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Powder Filling and Sintering of 3D In-chip Solenoid Coils with High Aspect Ratio Structure
In this study, a 3D coil embedded in a silicon substrate including densely distributed through-silicon vias (TSVs) was fabricated via a rapid metal powder sintering process. The filling and sintering methods for microdevices were evaluated, and the effects of powder types were compared. The paramete...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2020
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7142785/ https://www.ncbi.nlm.nih.gov/pubmed/32235795 http://dx.doi.org/10.3390/mi11030328 |