Using Digital Image Correlation on SEM Images of Strain Field after Ion Beam Milling for the Residual Stress Measurement of Thin Films

The residual stress of thin films during the deposition process can cause the components to have unpredictable deformation and damage, which could affect the service life and reliability of the microsystems. Developing an accurate and reliable method for measuring the residual stress of thin films a...

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Detalles Bibliográficos
Autores principales: Chen, Terry Yuan-Fang, Chou, Yun-Chia, Wang, Zhao-Ying, Lin, Wen-Yen, Lin, Ming-Tzer
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7142870/
https://www.ncbi.nlm.nih.gov/pubmed/32178450
http://dx.doi.org/10.3390/ma13061291

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7142870/
https://www.ncbi.nlm.nih.gov/pubmed/32178450
http://dx.doi.org/10.3390/ma13061291

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