Microstructure Characterization and Interfacial Reactions between Au-Sn Solder and Different Back Metallization Systems of GaAs MMICs

GaAs monolithic microwave integrated circuits (MMICs) with different back metallization systems (TiW/Au and Au/Ti/Au) exhibit different problems in the automatic Au-Sn eutectic bonding process, such as edge breakage or excessive voids. In this study, the formation mechanism of the edge breakage and...

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Detalles Bibliográficos
Autores principales: Wu, Na, Hu, Yongfang, Sun, Shufeng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7143372/
https://www.ncbi.nlm.nih.gov/pubmed/32168807
http://dx.doi.org/10.3390/ma13061266

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7143372/
https://www.ncbi.nlm.nih.gov/pubmed/32168807
http://dx.doi.org/10.3390/ma13061266

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