Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor

Piezoresistive silicon pressure sensor samples were thermally cycled after being consecutively packaged to three different levels. These started with the absolute minimum to allow measurement of the output and with each subsequent level incorporating additional packaging elements within the build. F...

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Detalles Bibliográficos
Autores principales: Hamid, Youssef, Hutt, David A., Whalley, David C., Craddock, Russell
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7146208/
https://www.ncbi.nlm.nih.gov/pubmed/32204556
http://dx.doi.org/10.3390/s20061727

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7146208/
https://www.ncbi.nlm.nih.gov/pubmed/32204556
http://dx.doi.org/10.3390/s20061727

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