Cargando…
Stress Distribution in Silicon Subjected to Atomic Scale Grinding with a Curved Tool Path
Molecular dynamics (MD) simulations were applied to study the fundamental mechanism of nanoscale grinding with a modeled tool trajectory of straight lines. Nevertheless, these models ignore curvature changes of actual tool paths, which need optimization to facilitate understanding of the underlying...
| Autores principales: | , , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2020
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7178638/ https://www.ncbi.nlm.nih.gov/pubmed/32268524 http://dx.doi.org/10.3390/ma13071710 |