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Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems
In this work, SiN(x)/a-Si/SiN(x) caps on conductive coplanar waveguides (CPWs) are proposed for thin film encapsulation of radio-frequency microelectromechanical systems (RF MEMS), in view of the application of these devices in fifth generation (5G) and modern telecommunication systems. Simplificati...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2020
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7180697/ https://www.ncbi.nlm.nih.gov/pubmed/32290063 http://dx.doi.org/10.3390/s20072133 |