Test Pattern Design for Plasma Induced Damage on Inter-Metal Dielectric in FinFET Cu BEOL Processes

High-density interconnects, enabled by advanced CMOS Cu BEOL technologies, lead to closely placed metals layers. High-aspect ratio metal lines require extensive plasma etching processes, which may cause reliability concerns on inter metal dielectric (IMD) layers. This study presents newly proposed t...

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Detalles Bibliográficos
Autores principales: Su, Chi, Tsai, Yi-Pei, Lin, Chrong-Jung, King, Ya-Chin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer US 2020
Materias:
Nano Express
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7195507/
https://www.ncbi.nlm.nih.gov/pubmed/32358682
http://dx.doi.org/10.1186/s11671-020-03328-7
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author Su, Chi
Tsai, Yi-Pei
Lin, Chrong-Jung
King, Ya-Chin
author_facet Su, Chi
Tsai, Yi-Pei
Lin, Chrong-Jung
King, Ya-Chin
author_sort Su, Chi
collection PubMed
description High-density interconnects, enabled by advanced CMOS Cu BEOL technologies, lead to closely placed metals layers. High-aspect ratio metal lines require extensive plasma etching processes, which may cause reliability concerns on inter metal dielectric (IMD) layers. This study presents newly proposed test patterns for evaluating the effect of plasma-induced charging effect on the integrity of IMD between closely placed metal lines. Strong correlations between the plasma charging intensities and damages found in IMD layers are found and analyzed comprehensively.
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spelling pubmed-71955072020-05-05 Test Pattern Design for Plasma Induced Damage on Inter-Metal Dielectric in FinFET Cu BEOL Processes Su, Chi Tsai, Yi-Pei Lin, Chrong-Jung King, Ya-Chin Nanoscale Res Lett Nano Express High-density interconnects, enabled by advanced CMOS Cu BEOL technologies, lead to closely placed metals layers. High-aspect ratio metal lines require extensive plasma etching processes, which may cause reliability concerns on inter metal dielectric (IMD) layers. This study presents newly proposed test patterns for evaluating the effect of plasma-induced charging effect on the integrity of IMD between closely placed metal lines. Strong correlations between the plasma charging intensities and damages found in IMD layers are found and analyzed comprehensively. Springer US 2020-05-01 /pmc/articles/PMC7195507/ /pubmed/32358682 http://dx.doi.org/10.1186/s11671-020-03328-7 Text en © The Author(s) 2020 Open AccessThis article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.
spellingShingle Nano Express
Su, Chi
Tsai, Yi-Pei
Lin, Chrong-Jung
King, Ya-Chin
Test Pattern Design for Plasma Induced Damage on Inter-Metal Dielectric in FinFET Cu BEOL Processes
title Test Pattern Design for Plasma Induced Damage on Inter-Metal Dielectric in FinFET Cu BEOL Processes
title_full Test Pattern Design for Plasma Induced Damage on Inter-Metal Dielectric in FinFET Cu BEOL Processes
title_fullStr Test Pattern Design for Plasma Induced Damage on Inter-Metal Dielectric in FinFET Cu BEOL Processes
title_full_unstemmed Test Pattern Design for Plasma Induced Damage on Inter-Metal Dielectric in FinFET Cu BEOL Processes
title_short Test Pattern Design for Plasma Induced Damage on Inter-Metal Dielectric in FinFET Cu BEOL Processes
title_sort test pattern design for plasma induced damage on inter-metal dielectric in finfet cu beol processes
topic Nano Express
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7195507/
https://www.ncbi.nlm.nih.gov/pubmed/32358682
http://dx.doi.org/10.1186/s11671-020-03328-7
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