Thermal Conductivity Characterization of Thermal Grease Containing Copper Nanopowder

As electronic devices and mainboards become smaller, the need for thermal conductive materials having excellent internal heat dissipation is increasing. In this study, nano thermal grease was prepared by mixing in copper nanopowder, which is used as a heat transfer medium in thermal grease, which is...

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Detalles Bibliográficos
Autores principales: Kang, Haneul, Kim, Hyunji, An, Jihye, Choi, Siyeon, Yang, Jinho, Jeong, Hyomin, Huh, Sunchul
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7215347/
https://www.ncbi.nlm.nih.gov/pubmed/32316526
http://dx.doi.org/10.3390/ma13081893

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7215347/
https://www.ncbi.nlm.nih.gov/pubmed/32316526
http://dx.doi.org/10.3390/ma13081893

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