Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress

The chip is the core component of the integrated circuit. Degradation and failure of chip solder joints can directly lead to function loss of the integrated circuit. In order to establish the degradation model of chip solder joints under coupled stress, this paper takes quad flat package (QFP) chip...

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Detalles Bibliográficos
Autores principales: Li, Longteng, Jing, Bo, Hu, Jiaxing
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7216068/
https://www.ncbi.nlm.nih.gov/pubmed/32290574
http://dx.doi.org/10.3390/ma13081813

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7216068/
https://www.ncbi.nlm.nih.gov/pubmed/32290574
http://dx.doi.org/10.3390/ma13081813

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