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Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress
The chip is the core component of the integrated circuit. Degradation and failure of chip solder joints can directly lead to function loss of the integrated circuit. In order to establish the degradation model of chip solder joints under coupled stress, this paper takes quad flat package (QFP) chip...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2020
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7216068/ https://www.ncbi.nlm.nih.gov/pubmed/32290574 http://dx.doi.org/10.3390/ma13081813 |