Decreasing Shear Stresses of the Solder Joints for Mechanical and Thermal Loads by Topological Optimization

A methodology for obtaining the optimal structure and distribution for the gradient properties of a material in order to reduce the stress level in a soldered joint was constructed. The developed methodology was based on a combination of topological optimization methods (the moving asymptotes method...

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Detalles Bibliográficos
Autores principales: Awrejcewicz, Jan, Pavlov, Sergey P., Krysko, Anton V., Zhigalov, Maxim V., Bodyagina, Kseniya S., Krysko, Vadim A.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7216155/
https://www.ncbi.nlm.nih.gov/pubmed/32326585
http://dx.doi.org/10.3390/ma13081862

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7216155/
https://www.ncbi.nlm.nih.gov/pubmed/32326585
http://dx.doi.org/10.3390/ma13081862

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