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Decreasing Shear Stresses of the Solder Joints for Mechanical and Thermal Loads by Topological Optimization
A methodology for obtaining the optimal structure and distribution for the gradient properties of a material in order to reduce the stress level in a soldered joint was constructed. The developed methodology was based on a combination of topological optimization methods (the moving asymptotes method...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2020
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7216155/ https://www.ncbi.nlm.nih.gov/pubmed/32326585 http://dx.doi.org/10.3390/ma13081862 |