Recent Advances on Thermal Management of Flexible Inorganic Electronics

Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissip...

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Detalles Bibliográficos
Autores principales: Li, Yuhang, Chen, Jiayun, Zhao, Shuang, Song, Jizhou
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7231351/
https://www.ncbi.nlm.nih.gov/pubmed/32283609
http://dx.doi.org/10.3390/mi11040390

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7231351/
https://www.ncbi.nlm.nih.gov/pubmed/32283609
http://dx.doi.org/10.3390/mi11040390

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