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Recent Advances on Thermal Management of Flexible Inorganic Electronics

Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissip...

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Detalles Bibliográficos
Autores principales: Li, Yuhang, Chen, Jiayun, Zhao, Shuang, Song, Jizhou
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7231351/
https://www.ncbi.nlm.nih.gov/pubmed/32283609
http://dx.doi.org/10.3390/mi11040390
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author Li, Yuhang
Chen, Jiayun
Zhao, Shuang
Song, Jizhou
author_facet Li, Yuhang
Chen, Jiayun
Zhao, Shuang
Song, Jizhou
author_sort Li, Yuhang
collection PubMed
description Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications.
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spelling pubmed-72313512020-05-22 Recent Advances on Thermal Management of Flexible Inorganic Electronics Li, Yuhang Chen, Jiayun Zhao, Shuang Song, Jizhou Micromachines (Basel) Review Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications. MDPI 2020-04-09 /pmc/articles/PMC7231351/ /pubmed/32283609 http://dx.doi.org/10.3390/mi11040390 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Review
Li, Yuhang
Chen, Jiayun
Zhao, Shuang
Song, Jizhou
Recent Advances on Thermal Management of Flexible Inorganic Electronics
title Recent Advances on Thermal Management of Flexible Inorganic Electronics
title_full Recent Advances on Thermal Management of Flexible Inorganic Electronics
title_fullStr Recent Advances on Thermal Management of Flexible Inorganic Electronics
title_full_unstemmed Recent Advances on Thermal Management of Flexible Inorganic Electronics
title_short Recent Advances on Thermal Management of Flexible Inorganic Electronics
title_sort recent advances on thermal management of flexible inorganic electronics
topic Review
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7231351/
https://www.ncbi.nlm.nih.gov/pubmed/32283609
http://dx.doi.org/10.3390/mi11040390
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