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Recent Advances on Thermal Management of Flexible Inorganic Electronics
Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissip...
Autores principales: | , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7231351/ https://www.ncbi.nlm.nih.gov/pubmed/32283609 http://dx.doi.org/10.3390/mi11040390 |
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author | Li, Yuhang Chen, Jiayun Zhao, Shuang Song, Jizhou |
author_facet | Li, Yuhang Chen, Jiayun Zhao, Shuang Song, Jizhou |
author_sort | Li, Yuhang |
collection | PubMed |
description | Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications. |
format | Online Article Text |
id | pubmed-7231351 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2020 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-72313512020-05-22 Recent Advances on Thermal Management of Flexible Inorganic Electronics Li, Yuhang Chen, Jiayun Zhao, Shuang Song, Jizhou Micromachines (Basel) Review Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications. MDPI 2020-04-09 /pmc/articles/PMC7231351/ /pubmed/32283609 http://dx.doi.org/10.3390/mi11040390 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Review Li, Yuhang Chen, Jiayun Zhao, Shuang Song, Jizhou Recent Advances on Thermal Management of Flexible Inorganic Electronics |
title | Recent Advances on Thermal Management of Flexible Inorganic Electronics |
title_full | Recent Advances on Thermal Management of Flexible Inorganic Electronics |
title_fullStr | Recent Advances on Thermal Management of Flexible Inorganic Electronics |
title_full_unstemmed | Recent Advances on Thermal Management of Flexible Inorganic Electronics |
title_short | Recent Advances on Thermal Management of Flexible Inorganic Electronics |
title_sort | recent advances on thermal management of flexible inorganic electronics |
topic | Review |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7231351/ https://www.ncbi.nlm.nih.gov/pubmed/32283609 http://dx.doi.org/10.3390/mi11040390 |
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