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Phase Formation and High-Temperature Stability of Very Thin Co-Sputtered Ti-Al and Multilayered Ti/Al Films on Thermally Oxidized Si Substrates
Ti-Al thin films with a thickness of 200 nm were prepared either by co-sputtering from elemental Ti and Al targets or as Ti/Al multilayers with 10 and 20 nm individual layer thickness on thermally oxidized Si substrates. Some of the films were covered with a 20-nm-thick SiO [Formula: see text] layer...
Autores principales: | Seifert, Marietta, Lattner, Eric, Menzel, Siegfried B., Oswald, Steffen, Gemming, Thomas |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7254394/ https://www.ncbi.nlm.nih.gov/pubmed/32349440 http://dx.doi.org/10.3390/ma13092039 |
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