Characterization of Thermal and Electrical Transport in 6.4 nm Au Films on Polyimide Film and Fiber Substrates

The surface and grain boundary scattering impact on the electrical and thermal conduction in the thin metallic films coated on organic substrates has not been studied thoroughly. In this work, we study heat and electron transport in the 6.4 nm thin Au films supported by polyimide (PI) substrate usin...

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Detalles Bibliográficos
Autores principales: Lin, Huan, Kou, Aijing, Cheng, Jian, Dong, Hua, Xu, Shen, Zhang, Jingkui, Luo, Siyi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7280525/
https://www.ncbi.nlm.nih.gov/pubmed/32514063
http://dx.doi.org/10.1038/s41598-020-66174-8

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7280525/
https://www.ncbi.nlm.nih.gov/pubmed/32514063
http://dx.doi.org/10.1038/s41598-020-66174-8

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