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Characterization of Thermal and Electrical Transport in 6.4 nm Au Films on Polyimide Film and Fiber Substrates
The surface and grain boundary scattering impact on the electrical and thermal conduction in the thin metallic films coated on organic substrates has not been studied thoroughly. In this work, we study heat and electron transport in the 6.4 nm thin Au films supported by polyimide (PI) substrate usin...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2020
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7280525/ https://www.ncbi.nlm.nih.gov/pubmed/32514063 http://dx.doi.org/10.1038/s41598-020-66174-8 |