A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties

Benzoxazine resin has been paid more attention in the fields of aviation, electronics, automobiles and new energy industries because of its excellent comprehensive performance. Further application is limited, however, by shortcomings such as high brittleness and high curing temperature. Furthermore,...

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Detalles Bibliográficos
Autores principales: Mei, Qilin, Wang, Honghua, Tong, Danliao, Song, Jiuqiang, Huang, Zhixiong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7284644/
https://www.ncbi.nlm.nih.gov/pubmed/32357390
http://dx.doi.org/10.3390/polym12050999

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7284644/
https://www.ncbi.nlm.nih.gov/pubmed/32357390
http://dx.doi.org/10.3390/polym12050999

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