Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics

[Image: see text] A new approach is presented to overcome the disadvantages of oxidation and harsh sintering conditions of Cu nanoparticle (Cu NP) conductive inks simultaneously. In this process, oleylamine (OAM) adsorbed on particles was effectively eliminated via the reactive desorption by formic...

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Detalles Bibliográficos
Autores principales: Dai, Xiaofeng, Zhang, Teng, Shi, Hongbin, Zhang, Yabing, Wang, Tao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2020
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7288703/
https://www.ncbi.nlm.nih.gov/pubmed/32548529
http://dx.doi.org/10.1021/acsomega.0c01678

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7288703/
https://www.ncbi.nlm.nih.gov/pubmed/32548529
http://dx.doi.org/10.1021/acsomega.0c01678

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