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Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics
[Image: see text] A new approach is presented to overcome the disadvantages of oxidation and harsh sintering conditions of Cu nanoparticle (Cu NP) conductive inks simultaneously. In this process, oleylamine (OAM) adsorbed on particles was effectively eliminated via the reactive desorption by formic...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
American Chemical Society
2020
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Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7288703/ https://www.ncbi.nlm.nih.gov/pubmed/32548529 http://dx.doi.org/10.1021/acsomega.0c01678 |
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author | Dai, Xiaofeng Zhang, Teng Shi, Hongbin Zhang, Yabing Wang, Tao |
author_facet | Dai, Xiaofeng Zhang, Teng Shi, Hongbin Zhang, Yabing Wang, Tao |
author_sort | Dai, Xiaofeng |
collection | PubMed |
description | [Image: see text] A new approach is presented to overcome the disadvantages of oxidation and harsh sintering conditions of Cu nanoparticle (Cu NP) conductive inks simultaneously. In this process, oleylamine (OAM) adsorbed on particles was effectively eliminated via the reactive desorption by formic acid in alcohols; meanwhile, Cu ion was generated on the surface. The desorption of OAM resulted in more severe surface oxidation of Cu NPs. The oxide (Cu(2)O) and Cu(2+) distributed on the Cu NP surface could be reduced to Cu(0) by NaBH(4) solution and take on the role of soldering flux to weld particles into a blocky structure. With the compact coalescence of particles without oxides, the resistivity of metal patterns could fall below 20 μΩ·cm and exhibit proper adhesion. Thanks to the sintering of Cu NPs at ambient conditions, the conductive patterns could be facilely formed on thermosensitive substrates. As the oxide state of Cu would be reduced during sintering, the partially oxidized Cu nanoparticles could be directly applied to conductive inks. |
format | Online Article Text |
id | pubmed-7288703 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2020 |
publisher | American Chemical Society |
record_format | MEDLINE/PubMed |
spelling | pubmed-72887032020-06-15 Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics Dai, Xiaofeng Zhang, Teng Shi, Hongbin Zhang, Yabing Wang, Tao ACS Omega [Image: see text] A new approach is presented to overcome the disadvantages of oxidation and harsh sintering conditions of Cu nanoparticle (Cu NP) conductive inks simultaneously. In this process, oleylamine (OAM) adsorbed on particles was effectively eliminated via the reactive desorption by formic acid in alcohols; meanwhile, Cu ion was generated on the surface. The desorption of OAM resulted in more severe surface oxidation of Cu NPs. The oxide (Cu(2)O) and Cu(2+) distributed on the Cu NP surface could be reduced to Cu(0) by NaBH(4) solution and take on the role of soldering flux to weld particles into a blocky structure. With the compact coalescence of particles without oxides, the resistivity of metal patterns could fall below 20 μΩ·cm and exhibit proper adhesion. Thanks to the sintering of Cu NPs at ambient conditions, the conductive patterns could be facilely formed on thermosensitive substrates. As the oxide state of Cu would be reduced during sintering, the partially oxidized Cu nanoparticles could be directly applied to conductive inks. American Chemical Society 2020-05-29 /pmc/articles/PMC7288703/ /pubmed/32548529 http://dx.doi.org/10.1021/acsomega.0c01678 Text en Copyright © 2020 American Chemical Society This is an open access article published under an ACS AuthorChoice License (http://pubs.acs.org/page/policy/authorchoice_termsofuse.html) , which permits copying and redistribution of the article or any adaptations for non-commercial purposes. |
spellingShingle | Dai, Xiaofeng Zhang, Teng Shi, Hongbin Zhang, Yabing Wang, Tao Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics |
title | Reactive Sintering of Cu Nanoparticles at Ambient
Conditions for Printed Electronics |
title_full | Reactive Sintering of Cu Nanoparticles at Ambient
Conditions for Printed Electronics |
title_fullStr | Reactive Sintering of Cu Nanoparticles at Ambient
Conditions for Printed Electronics |
title_full_unstemmed | Reactive Sintering of Cu Nanoparticles at Ambient
Conditions for Printed Electronics |
title_short | Reactive Sintering of Cu Nanoparticles at Ambient
Conditions for Printed Electronics |
title_sort | reactive sintering of cu nanoparticles at ambient
conditions for printed electronics |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7288703/ https://www.ncbi.nlm.nih.gov/pubmed/32548529 http://dx.doi.org/10.1021/acsomega.0c01678 |
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