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Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics

[Image: see text] A new approach is presented to overcome the disadvantages of oxidation and harsh sintering conditions of Cu nanoparticle (Cu NP) conductive inks simultaneously. In this process, oleylamine (OAM) adsorbed on particles was effectively eliminated via the reactive desorption by formic...

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Autores principales: Dai, Xiaofeng, Zhang, Teng, Shi, Hongbin, Zhang, Yabing, Wang, Tao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2020
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7288703/
https://www.ncbi.nlm.nih.gov/pubmed/32548529
http://dx.doi.org/10.1021/acsomega.0c01678
_version_ 1783545328170958848
author Dai, Xiaofeng
Zhang, Teng
Shi, Hongbin
Zhang, Yabing
Wang, Tao
author_facet Dai, Xiaofeng
Zhang, Teng
Shi, Hongbin
Zhang, Yabing
Wang, Tao
author_sort Dai, Xiaofeng
collection PubMed
description [Image: see text] A new approach is presented to overcome the disadvantages of oxidation and harsh sintering conditions of Cu nanoparticle (Cu NP) conductive inks simultaneously. In this process, oleylamine (OAM) adsorbed on particles was effectively eliminated via the reactive desorption by formic acid in alcohols; meanwhile, Cu ion was generated on the surface. The desorption of OAM resulted in more severe surface oxidation of Cu NPs. The oxide (Cu(2)O) and Cu(2+) distributed on the Cu NP surface could be reduced to Cu(0) by NaBH(4) solution and take on the role of soldering flux to weld particles into a blocky structure. With the compact coalescence of particles without oxides, the resistivity of metal patterns could fall below 20 μΩ·cm and exhibit proper adhesion. Thanks to the sintering of Cu NPs at ambient conditions, the conductive patterns could be facilely formed on thermosensitive substrates. As the oxide state of Cu would be reduced during sintering, the partially oxidized Cu nanoparticles could be directly applied to conductive inks.
format Online
Article
Text
id pubmed-7288703
institution National Center for Biotechnology Information
language English
publishDate 2020
publisher American Chemical Society
record_format MEDLINE/PubMed
spelling pubmed-72887032020-06-15 Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics Dai, Xiaofeng Zhang, Teng Shi, Hongbin Zhang, Yabing Wang, Tao ACS Omega [Image: see text] A new approach is presented to overcome the disadvantages of oxidation and harsh sintering conditions of Cu nanoparticle (Cu NP) conductive inks simultaneously. In this process, oleylamine (OAM) adsorbed on particles was effectively eliminated via the reactive desorption by formic acid in alcohols; meanwhile, Cu ion was generated on the surface. The desorption of OAM resulted in more severe surface oxidation of Cu NPs. The oxide (Cu(2)O) and Cu(2+) distributed on the Cu NP surface could be reduced to Cu(0) by NaBH(4) solution and take on the role of soldering flux to weld particles into a blocky structure. With the compact coalescence of particles without oxides, the resistivity of metal patterns could fall below 20 μΩ·cm and exhibit proper adhesion. Thanks to the sintering of Cu NPs at ambient conditions, the conductive patterns could be facilely formed on thermosensitive substrates. As the oxide state of Cu would be reduced during sintering, the partially oxidized Cu nanoparticles could be directly applied to conductive inks. American Chemical Society 2020-05-29 /pmc/articles/PMC7288703/ /pubmed/32548529 http://dx.doi.org/10.1021/acsomega.0c01678 Text en Copyright © 2020 American Chemical Society This is an open access article published under an ACS AuthorChoice License (http://pubs.acs.org/page/policy/authorchoice_termsofuse.html) , which permits copying and redistribution of the article or any adaptations for non-commercial purposes.
spellingShingle Dai, Xiaofeng
Zhang, Teng
Shi, Hongbin
Zhang, Yabing
Wang, Tao
Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics
title Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics
title_full Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics
title_fullStr Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics
title_full_unstemmed Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics
title_short Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics
title_sort reactive sintering of cu nanoparticles at ambient conditions for printed electronics
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7288703/
https://www.ncbi.nlm.nih.gov/pubmed/32548529
http://dx.doi.org/10.1021/acsomega.0c01678
work_keys_str_mv AT daixiaofeng reactivesinteringofcunanoparticlesatambientconditionsforprintedelectronics
AT zhangteng reactivesinteringofcunanoparticlesatambientconditionsforprintedelectronics
AT shihongbin reactivesinteringofcunanoparticlesatambientconditionsforprintedelectronics
AT zhangyabing reactivesinteringofcunanoparticlesatambientconditionsforprintedelectronics
AT wangtao reactivesinteringofcunanoparticlesatambientconditionsforprintedelectronics