Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer

Silicon wafer with high surface quality is widely used as substrate materials in the fields of micromachines and microelectronics, so a high-efficiency and high-quality polishing method is urgently needed to meet its large demand. In this paper, a dielectrophoresis polishing (DEPP) method was propos...

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Detalles Bibliográficos
Autores principales: Zhao, Tianchen, Deng, Qianfa, Zhang, Cheng, Feng, Kaiping, Zhou, Zhaozhong, Yuan, Julong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7345328/
https://www.ncbi.nlm.nih.gov/pubmed/32471163
http://dx.doi.org/10.3390/mi11060544

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7345328/
https://www.ncbi.nlm.nih.gov/pubmed/32471163
http://dx.doi.org/10.3390/mi11060544

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