Feasibility Study of an Automated Assembly Process for Ultrathin Chips

This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, hig...

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Detalles Bibliográficos
Autores principales: Janek, Florian, Saller, Ebru, Müller, Ernst, Meißner, Thomas, Weser, Sascha, Barth, Maximilian, Eberhardt, Wolfgang, Zimmermann, André
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7408208/
https://www.ncbi.nlm.nih.gov/pubmed/32629981
http://dx.doi.org/10.3390/mi11070654

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7408208/
https://www.ncbi.nlm.nih.gov/pubmed/32629981
http://dx.doi.org/10.3390/mi11070654

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