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Feasibility Study of an Automated Assembly Process for Ultrathin Chips
This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, hig...
Autores principales: | Janek, Florian, Saller, Ebru, Müller, Ernst, Meißner, Thomas, Weser, Sascha, Barth, Maximilian, Eberhardt, Wolfgang, Zimmermann, André |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7408208/ https://www.ncbi.nlm.nih.gov/pubmed/32629981 http://dx.doi.org/10.3390/mi11070654 |
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