The Mechanism of Layer Stacked Clamping (LSC) for Polishing Ultra-Thin Sapphire Wafer

Double-sides polishing technology has the advantages of high flatness and parallelism, and high polishing efficiency. It is the preferred polishing method for the preparation of ultra-thin sapphire wafer. However, the clamping method is a fundamental problem which is currently difficult to solve. In...

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Detalles Bibliográficos
Autores principales: Chen, Zhixiang, Cao, Linlin, Yuan, Julong, Lyu, Binghai, Hang, Wei, Wang, Jiahuan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7464148/
https://www.ncbi.nlm.nih.gov/pubmed/32781686
http://dx.doi.org/10.3390/mi11080759

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7464148/
https://www.ncbi.nlm.nih.gov/pubmed/32781686
http://dx.doi.org/10.3390/mi11080759

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