Universal inherent fluctuations in statistical counting of large particles in slurry used for semiconductor manufacturing

In the chemical mechanical polishing process of semiconductor manufacturing, the concentration of ‘large’ particles ([Formula: see text] 0.5 μm) in the slurry, which is considerably larger in size than the main abrasives ([Formula: see text] 0.1 μm), is a critical parameter that strongly influences...

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Detalles Bibliográficos
Autores principales: Lee, Manhee, Kim, Dongwon, Heo, Tae-Young, Park, Taewon, Kim, Wonjung, Choi, Daejin, Kim, Hyunwoo, Kim, Jaehyun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7477581/
https://www.ncbi.nlm.nih.gov/pubmed/32895450
http://dx.doi.org/10.1038/s41598-020-71768-3

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7477581/
https://www.ncbi.nlm.nih.gov/pubmed/32895450
http://dx.doi.org/10.1038/s41598-020-71768-3

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