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Universal inherent fluctuations in statistical counting of large particles in slurry used for semiconductor manufacturing
In the chemical mechanical polishing process of semiconductor manufacturing, the concentration of ‘large’ particles ([Formula: see text] 0.5 μm) in the slurry, which is considerably larger in size than the main abrasives ([Formula: see text] 0.1 μm), is a critical parameter that strongly influences...
Autores principales: | Lee, Manhee, Kim, Dongwon, Heo, Tae-Young, Park, Taewon, Kim, Wonjung, Choi, Daejin, Kim, Hyunwoo, Kim, Jaehyun |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7477581/ https://www.ncbi.nlm.nih.gov/pubmed/32895450 http://dx.doi.org/10.1038/s41598-020-71768-3 |
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