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A Novel Inspection Technique for Electronic Components Using Thermography (NITECT)

Unverified or counterfeited electronic components pose a big threat globally because they could lead to malfunction of safety-critical systems and reduced reliability of high-hazard assets. The current inspection techniques are either expensive or slow, which becomes the bottleneck of large volume i...

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Autores principales: Liu, Haochen, Tinsley, Lawrence, Lam, Wayne, Addepalli, Sri, Liu, Xiaochen, Starr, Andrew, Zhao, Yifan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7506598/
https://www.ncbi.nlm.nih.gov/pubmed/32899391
http://dx.doi.org/10.3390/s20175013
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author Liu, Haochen
Tinsley, Lawrence
Lam, Wayne
Addepalli, Sri
Liu, Xiaochen
Starr, Andrew
Zhao, Yifan
author_facet Liu, Haochen
Tinsley, Lawrence
Lam, Wayne
Addepalli, Sri
Liu, Xiaochen
Starr, Andrew
Zhao, Yifan
author_sort Liu, Haochen
collection PubMed
description Unverified or counterfeited electronic components pose a big threat globally because they could lead to malfunction of safety-critical systems and reduced reliability of high-hazard assets. The current inspection techniques are either expensive or slow, which becomes the bottleneck of large volume inspection. As a complement of the existing inspection capabilities, a pulsed thermography-based screening technique is proposed in this paper using a digital twin methodology. A FEM-based simulation unit is initially developed to simulate the internal structure of electronic components with deviations of multiple physical properties, informed by X-ray data, along with its thermal behaviour under exposure to instantaneous heat. A dedicated physical inspection unit is then integrated to verify the simulation unit and further improve the simulation by taking account of various uncertainties caused by equipment and samples. Principle component analysis is used for feature extraction, and then a set of machine learning-based classifiers are employed for quantitative classification. Evaluation results of 17 chips from different sources successfully demonstrate the effectiveness of the proposed technique.
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spelling pubmed-75065982020-09-26 A Novel Inspection Technique for Electronic Components Using Thermography (NITECT) Liu, Haochen Tinsley, Lawrence Lam, Wayne Addepalli, Sri Liu, Xiaochen Starr, Andrew Zhao, Yifan Sensors (Basel) Article Unverified or counterfeited electronic components pose a big threat globally because they could lead to malfunction of safety-critical systems and reduced reliability of high-hazard assets. The current inspection techniques are either expensive or slow, which becomes the bottleneck of large volume inspection. As a complement of the existing inspection capabilities, a pulsed thermography-based screening technique is proposed in this paper using a digital twin methodology. A FEM-based simulation unit is initially developed to simulate the internal structure of electronic components with deviations of multiple physical properties, informed by X-ray data, along with its thermal behaviour under exposure to instantaneous heat. A dedicated physical inspection unit is then integrated to verify the simulation unit and further improve the simulation by taking account of various uncertainties caused by equipment and samples. Principle component analysis is used for feature extraction, and then a set of machine learning-based classifiers are employed for quantitative classification. Evaluation results of 17 chips from different sources successfully demonstrate the effectiveness of the proposed technique. MDPI 2020-09-03 /pmc/articles/PMC7506598/ /pubmed/32899391 http://dx.doi.org/10.3390/s20175013 Text en © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Liu, Haochen
Tinsley, Lawrence
Lam, Wayne
Addepalli, Sri
Liu, Xiaochen
Starr, Andrew
Zhao, Yifan
A Novel Inspection Technique for Electronic Components Using Thermography (NITECT)
title A Novel Inspection Technique for Electronic Components Using Thermography (NITECT)
title_full A Novel Inspection Technique for Electronic Components Using Thermography (NITECT)
title_fullStr A Novel Inspection Technique for Electronic Components Using Thermography (NITECT)
title_full_unstemmed A Novel Inspection Technique for Electronic Components Using Thermography (NITECT)
title_short A Novel Inspection Technique for Electronic Components Using Thermography (NITECT)
title_sort novel inspection technique for electronic components using thermography (nitect)
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7506598/
https://www.ncbi.nlm.nih.gov/pubmed/32899391
http://dx.doi.org/10.3390/s20175013
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