Ultimate suppression of thermal transport in amorphous silicon nitride by phononic nanostructure

Engineering the thermal conductivity of amorphous materials is highly essential for the thermal management of future electronic devices. Here, we demonstrate the impact of ultrafine nanostructuring on the thermal conductivity reduction of amorphous silicon nitride (a-Si(3)N(4)) thin films, in which...

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Detalles Bibliográficos
Autores principales: Tambo, Naoki, Liao, Yuxuan, Zhou, Chun, Ashley, Elizabeth Michiko, Takahashi, Kouhei, Nealey, Paul F., Naito, Yasuyuki, Shiomi, Junichiro
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Association for the Advancement of Science 2020
Materias:
Research Articles
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7518865/
https://www.ncbi.nlm.nih.gov/pubmed/32978150
http://dx.doi.org/10.1126/sciadv.abc0075

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7518865/
https://www.ncbi.nlm.nih.gov/pubmed/32978150
http://dx.doi.org/10.1126/sciadv.abc0075

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