Inflight fiber printing toward array and 3D optoelectronic and sensing architectures

Scalability and device integration have been prevailing issues limiting our ability in harnessing the potential of small-diameter conducting fibers. We report inflight fiber printing (iFP), a one-step process that integrates conducting fiber production and fiber-to-circuit connection. Inorganic (sil...

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Detalles Bibliográficos
Autores principales: Wang, Wenyu, Ouaras, Karim, Rutz, Alexandra L., Li, Xia, Gerigk, Magda, Naegele, Tobias E., Malliaras, George G., Huang, Yan Yan Shery
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Association for the Advancement of Science 2020
Materias:
Research Articles
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7527227/
https://www.ncbi.nlm.nih.gov/pubmed/32998891
http://dx.doi.org/10.1126/sciadv.aba0931

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7527227/
https://www.ncbi.nlm.nih.gov/pubmed/32998891
http://dx.doi.org/10.1126/sciadv.aba0931

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