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Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction
This work examines the filling of Through Silicon Vias (TSV) by Ni deposition from a NiSO(4) + NiCl(2) + H(3)BO(3) electrolyte containing a branched polyethyleneimine suppressor. Feature filling occurs due to the interaction of transport limited suppressor adsorption and its consumption by potential...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
2018
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7537468/ https://www.ncbi.nlm.nih.gov/pubmed/33029030 |