Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias

This work demonstrates void-free Cu filling of millimeter size Through Silicon Vias (mm-TSV) in an acid copper sulfate electrolyte using a combination of a poloxamine suppressor and chloride, analogous to previous work filling TSV that were an order of magnitude smaller in size. For high chloride co...

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Detalles Bibliográficos
Autores principales: Josell, D., Menk, L. A., Hollowell, A. E., Blain, M., Moffat, T. P.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7542680/
https://www.ncbi.nlm.nih.gov/pubmed/33041355

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7542680/
https://www.ncbi.nlm.nih.gov/pubmed/33041355

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