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Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias
This work demonstrates void-free Cu filling of millimeter size Through Silicon Vias (mm-TSV) in an acid copper sulfate electrolyte using a combination of a poloxamine suppressor and chloride, analogous to previous work filling TSV that were an order of magnitude smaller in size. For high chloride co...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7542680/ https://www.ncbi.nlm.nih.gov/pubmed/33041355 |