The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

To obtain Sn-3.0Ag-0.5Cu-xSb (x = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA4...

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Detalles Bibliográficos
Autores principales: Li, Chaojun, Yan, Yanfu, Gao, Tingting, Xu, Guodong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7579258/
https://www.ncbi.nlm.nih.gov/pubmed/33036405
http://dx.doi.org/10.3390/ma13194443

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7579258/
https://www.ncbi.nlm.nih.gov/pubmed/33036405
http://dx.doi.org/10.3390/ma13194443

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