Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability...

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Detalles Bibliográficos
Autores principales: Xu, Kai-Kai, Zhang, Liang, Gao, Li-Li, Jiang, Nan, Zhang, Lei, Zhong, Su-Juan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Taylor & Francis 2020
Materias:
Optical, Magnetic and Electronic Device Materials
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7594718/
https://www.ncbi.nlm.nih.gov/pubmed/33177953
http://dx.doi.org/10.1080/14686996.2020.1824255

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7594718/
https://www.ncbi.nlm.nih.gov/pubmed/33177953
http://dx.doi.org/10.1080/14686996.2020.1824255

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