Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability...

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Detalles Bibliográficos
Autores principales: Xu, Kai-Kai, Zhang, Liang, Gao, Li-Li, Jiang, Nan, Zhang, Lei, Zhong, Su-Juan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Taylor & Francis 2020
Materias:
Optical, Magnetic and Electronic Device Materials
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7594718/
https://www.ncbi.nlm.nih.gov/pubmed/33177953
http://dx.doi.org/10.1080/14686996.2020.1824255
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author Xu, Kai-Kai
Zhang, Liang
Gao, Li-Li
Jiang, Nan
Zhang, Lei
Zhong, Su-Juan
author_facet Xu, Kai-Kai
Zhang, Liang
Gao, Li-Li
Jiang, Nan
Zhang, Lei
Zhong, Su-Juan
author_sort Xu, Kai-Kai
collection PubMed
description Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders.
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spelling pubmed-75947182020-11-10 Review of microstructure and properties of low temperature lead-free solder in electronic packaging Xu, Kai-Kai Zhang, Liang Gao, Li-Li Jiang, Nan Zhang, Lei Zhong, Su-Juan Sci Technol Adv Mater Optical, Magnetic and Electronic Device Materials Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders. Taylor & Francis 2020-10-19 /pmc/articles/PMC7594718/ /pubmed/33177953 http://dx.doi.org/10.1080/14686996.2020.1824255 Text en © 2020 The Author(s). Published by National Institute for Materials Science in partnership with Taylor & Francis Group. https://creativecommons.org/licenses/by/4.0/This is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) ), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
spellingShingle Optical, Magnetic and Electronic Device Materials
Xu, Kai-Kai
Zhang, Liang
Gao, Li-Li
Jiang, Nan
Zhang, Lei
Zhong, Su-Juan
Review of microstructure and properties of low temperature lead-free solder in electronic packaging
title Review of microstructure and properties of low temperature lead-free solder in electronic packaging
title_full Review of microstructure and properties of low temperature lead-free solder in electronic packaging
title_fullStr Review of microstructure and properties of low temperature lead-free solder in electronic packaging
title_full_unstemmed Review of microstructure and properties of low temperature lead-free solder in electronic packaging
title_short Review of microstructure and properties of low temperature lead-free solder in electronic packaging
title_sort review of microstructure and properties of low temperature lead-free solder in electronic packaging
topic Optical, Magnetic and Electronic Device Materials
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7594718/
https://www.ncbi.nlm.nih.gov/pubmed/33177953
http://dx.doi.org/10.1080/14686996.2020.1824255
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