Epitaxial Growth of Silicon on Silicon Wafers by Direct Laser Melting

Additive manufacturing (AM) of brittle materials remains challenging, as they are prone to cracking due to the steep thermal gradients present during melting and cooling after laser exposition. Silicon is an ideal brittle material for study since most of the physical properties of single-element mat...

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Detalles Bibliográficos
Autores principales: Le Dantec, Marie, Abdulstaar, Mustafa, Leparoux, Marc, Hoffmann, Patrik
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Communication
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7660219/
https://www.ncbi.nlm.nih.gov/pubmed/33113916
http://dx.doi.org/10.3390/ma13214728

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7660219/
https://www.ncbi.nlm.nih.gov/pubmed/33113916
http://dx.doi.org/10.3390/ma13214728

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