Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element Simulation

This study uses the finite element analysis (FEA)-based atomistic-continuum method (ACM) combined with the Morse potential of metals to determine the effects of the elastic modulus (E) of a given example on atomic-level single-crystal copper (Cu). This work aims to overcome the estimated drawback of...

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Detalles Bibliográficos
Autores principales: Lee, Chang-Chun, He, Jing-Yan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7662663/
https://www.ncbi.nlm.nih.gov/pubmed/33153184
http://dx.doi.org/10.3390/molecules25215107

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7662663/
https://www.ncbi.nlm.nih.gov/pubmed/33153184
http://dx.doi.org/10.3390/molecules25215107

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