Cargando…
Anti-oxidant copper layer by remote mode N(2) plasma for low temperature copper–copper bonding
An anti-oxidant Cu layer was achieved by remote mode N(2) plasma. Remote mode plasma treatment offers the advantages of having no defect formation, such as pinholes, by energetic ions. In this study, an activated Cu surface by Ar plasma chemically reacted with N free radicals to evenly form Cu nitri...
| Autores principales: | , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2020
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7730425/ https://www.ncbi.nlm.nih.gov/pubmed/33303825 http://dx.doi.org/10.1038/s41598-020-78396-x |