Melt Blown Fiber-Assisted Solvent-Free Device Fabrication at Low-Temperature

In this paper, we propose a solvent-free device fabrication method using a melt-blown (MB) fiber to minimize potential chemical and thermal damages to transition-metal-dichalcogenides (TMDCs)-based semiconductor channel. The fabrication process is composed of three steps; (1) MB fibers alignment as...

Descripción completa

Detalles Bibliográficos
Autores principales: Lee, Minjong, Kang, Joohoon, Lee, Young Tack
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7763187/
https://www.ncbi.nlm.nih.gov/pubmed/33321712
http://dx.doi.org/10.3390/mi11121091

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7763187/
https://www.ncbi.nlm.nih.gov/pubmed/33321712
http://dx.doi.org/10.3390/mi11121091

Ejemplares similares