Cargando…
Melt Blown Fiber-Assisted Solvent-Free Device Fabrication at Low-Temperature
In this paper, we propose a solvent-free device fabrication method using a melt-blown (MB) fiber to minimize potential chemical and thermal damages to transition-metal-dichalcogenides (TMDCs)-based semiconductor channel. The fabrication process is composed of three steps; (1) MB fibers alignment as...
| Autores principales: | , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2020
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7763187/ https://www.ncbi.nlm.nih.gov/pubmed/33321712 http://dx.doi.org/10.3390/mi11121091 |