Effect of Copper Sulfate and Sulfuric Acid on Blind Hole Filling of HDI Circuit Boards by Electroplating

Here, in a certain high density interconnect (HDI) printed circuit board, the effect of copper sulfate and sulfuric acid on the filling effect of a blind hole with a certain diameter and depth was investigated by making a blind hole using a CO(2) laser drilling machine, filling the blind hole via el...

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Detalles Bibliográficos
Autores principales: Tao, Pingjun, Chen, Yugan, Cai, Weitong, Meng, Zhaoguang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7796361/
https://www.ncbi.nlm.nih.gov/pubmed/33375391
http://dx.doi.org/10.3390/ma14010085

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7796361/
https://www.ncbi.nlm.nih.gov/pubmed/33375391
http://dx.doi.org/10.3390/ma14010085

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