Preparation, Properties and Mechanisms of Carbon Fiber/Polymer Composites for Thermal Management Applications

With the increasing integration and miniaturization of electronic devices, heat dissipation has become a major challenge. The traditional printed polymer circuit board can no longer meet the heat dissipation demands of microelectronic equipment. If the heat cannot be removed quickly and effectively,...

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Detalles Bibliográficos
Autores principales: Ali, Zulfiqar, Gao, Yuan, Tang, Bo, Wu, Xinfeng, Wang, Ying, Li, Maohua, Hou, Xiao, Li, Linhong, Jiang, Nan, Yu, Jinhong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7796458/
https://www.ncbi.nlm.nih.gov/pubmed/33466509
http://dx.doi.org/10.3390/polym13010169

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7796458/
https://www.ncbi.nlm.nih.gov/pubmed/33466509
http://dx.doi.org/10.3390/polym13010169

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