Applying microscopic analytic techniques for failure analysis in electronic assemblies

The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform-Infrared (FTIR) microscopy is used for documentation and failure localiz...

Descripción completa

Detalles Bibliográficos
Autores principales: Grosshardt, Otto, Nagy, Boldizsár Árpád, Laetsch, Anette
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer Singapore 2019
Materias:
Research
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7818370/
https://www.ncbi.nlm.nih.gov/pubmed/33580304
http://dx.doi.org/10.1186/s42649-019-0009-1

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7818370/
https://www.ncbi.nlm.nih.gov/pubmed/33580304
http://dx.doi.org/10.1186/s42649-019-0009-1

Ejemplares similares