Applying microscopic analytic techniques for failure analysis in electronic assemblies

The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform-Infrared (FTIR) microscopy is used for documentation and failure localization on electronic samples surface. For internal observable conditions a metallographic cross-section analysis of the sample is required. The aim of this work is to present some internal and external observable nonconformities which frequently appear in electronic assemblies. In order to detect these nonconformities, optical microscopy, cross section analysis, FTIR-microscopy and scanning electron microscopy with energy dispersive spectrometry (SEM-EDS) were used as analytical techniques.