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Applying microscopic analytic techniques for failure analysis in electronic assemblies
The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform-Infrared (FTIR) microscopy is used for documentation and failure localiz...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer Singapore
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7818370/ https://www.ncbi.nlm.nih.gov/pubmed/33580304 http://dx.doi.org/10.1186/s42649-019-0009-1 |