Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement

Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethan...

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Detalles Bibliográficos
Autores principales: Su, Kai-Han, Su, Cherng-Yuh, Chi, Po-Wei, Chandan, Prem, Cho, Cheng-Ta, Chi, Wan-Yu, Wu, Maw-Kuen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7825067/
https://www.ncbi.nlm.nih.gov/pubmed/33418935
http://dx.doi.org/10.3390/ma14020238

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7825067/
https://www.ncbi.nlm.nih.gov/pubmed/33418935
http://dx.doi.org/10.3390/ma14020238

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