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Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement
Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethan...
Autores principales: | , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7825067/ https://www.ncbi.nlm.nih.gov/pubmed/33418935 http://dx.doi.org/10.3390/ma14020238 |
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author | Su, Kai-Han Su, Cherng-Yuh Chi, Po-Wei Chandan, Prem Cho, Cheng-Ta Chi, Wan-Yu Wu, Maw-Kuen |
author_facet | Su, Kai-Han Su, Cherng-Yuh Chi, Po-Wei Chandan, Prem Cho, Cheng-Ta Chi, Wan-Yu Wu, Maw-Kuen |
author_sort | Su, Kai-Han |
collection | PubMed |
description | Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing. |
format | Online Article Text |
id | pubmed-7825067 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2021 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-78250672021-01-24 Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement Su, Kai-Han Su, Cherng-Yuh Chi, Po-Wei Chandan, Prem Cho, Cheng-Ta Chi, Wan-Yu Wu, Maw-Kuen Materials (Basel) Article Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing. MDPI 2021-01-06 /pmc/articles/PMC7825067/ /pubmed/33418935 http://dx.doi.org/10.3390/ma14020238 Text en © 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Su, Kai-Han Su, Cherng-Yuh Chi, Po-Wei Chandan, Prem Cho, Cheng-Ta Chi, Wan-Yu Wu, Maw-Kuen Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement |
title | Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement |
title_full | Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement |
title_fullStr | Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement |
title_full_unstemmed | Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement |
title_short | Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement |
title_sort | generation of self-assembled 3d network in tpu by insertion of al(2)o(3)/h-bn hybrid for thermal conductivity enhancement |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7825067/ https://www.ncbi.nlm.nih.gov/pubmed/33418935 http://dx.doi.org/10.3390/ma14020238 |
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