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Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement

Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethan...

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Detalles Bibliográficos
Autores principales: Su, Kai-Han, Su, Cherng-Yuh, Chi, Po-Wei, Chandan, Prem, Cho, Cheng-Ta, Chi, Wan-Yu, Wu, Maw-Kuen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7825067/
https://www.ncbi.nlm.nih.gov/pubmed/33418935
http://dx.doi.org/10.3390/ma14020238
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author Su, Kai-Han
Su, Cherng-Yuh
Chi, Po-Wei
Chandan, Prem
Cho, Cheng-Ta
Chi, Wan-Yu
Wu, Maw-Kuen
author_facet Su, Kai-Han
Su, Cherng-Yuh
Chi, Po-Wei
Chandan, Prem
Cho, Cheng-Ta
Chi, Wan-Yu
Wu, Maw-Kuen
author_sort Su, Kai-Han
collection PubMed
description Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing.
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spelling pubmed-78250672021-01-24 Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement Su, Kai-Han Su, Cherng-Yuh Chi, Po-Wei Chandan, Prem Cho, Cheng-Ta Chi, Wan-Yu Wu, Maw-Kuen Materials (Basel) Article Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing. MDPI 2021-01-06 /pmc/articles/PMC7825067/ /pubmed/33418935 http://dx.doi.org/10.3390/ma14020238 Text en © 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Su, Kai-Han
Su, Cherng-Yuh
Chi, Po-Wei
Chandan, Prem
Cho, Cheng-Ta
Chi, Wan-Yu
Wu, Maw-Kuen
Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement
title Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement
title_full Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement
title_fullStr Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement
title_full_unstemmed Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement
title_short Generation of Self-Assembled 3D Network in TPU by Insertion of Al(2)O(3)/h-BN Hybrid for Thermal Conductivity Enhancement
title_sort generation of self-assembled 3d network in tpu by insertion of al(2)o(3)/h-bn hybrid for thermal conductivity enhancement
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7825067/
https://www.ncbi.nlm.nih.gov/pubmed/33418935
http://dx.doi.org/10.3390/ma14020238
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