Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic s...

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Detalles Bibliográficos
Autores principales: Jeong, Gyuwon, Yu, Dong-Yurl, Baek, Seongju, Bang, Junghwan, Lee, Tae-Ik, Jung, Seung-Boo, Kim, JungSoo, Ko, Yong-Ho
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7826748/
https://www.ncbi.nlm.nih.gov/pubmed/33440741
http://dx.doi.org/10.3390/ma14020335

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7826748/
https://www.ncbi.nlm.nih.gov/pubmed/33440741
http://dx.doi.org/10.3390/ma14020335

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