Cargando…

Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic s...

Descripción completa

Detalles Bibliográficos
Autores principales: Jeong, Gyuwon, Yu, Dong-Yurl, Baek, Seongju, Bang, Junghwan, Lee, Tae-Ik, Jung, Seung-Boo, Kim, JungSoo, Ko, Yong-Ho
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7826748/
https://www.ncbi.nlm.nih.gov/pubmed/33440741
http://dx.doi.org/10.3390/ma14020335
_version_ 1783640594373935104
author Jeong, Gyuwon
Yu, Dong-Yurl
Baek, Seongju
Bang, Junghwan
Lee, Tae-Ik
Jung, Seung-Boo
Kim, JungSoo
Ko, Yong-Ho
author_facet Jeong, Gyuwon
Yu, Dong-Yurl
Baek, Seongju
Bang, Junghwan
Lee, Tae-Ik
Jung, Seung-Boo
Kim, JungSoo
Ko, Yong-Ho
author_sort Jeong, Gyuwon
collection PubMed
description The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu(6)Sn(5) and Cu(3)Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag(3)Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.
format Online
Article
Text
id pubmed-7826748
institution National Center for Biotechnology Information
language English
publishDate 2021
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-78267482021-01-25 Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding Jeong, Gyuwon Yu, Dong-Yurl Baek, Seongju Bang, Junghwan Lee, Tae-Ik Jung, Seung-Boo Kim, JungSoo Ko, Yong-Ho Materials (Basel) Article The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu(6)Sn(5) and Cu(3)Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag(3)Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs. MDPI 2021-01-11 /pmc/articles/PMC7826748/ /pubmed/33440741 http://dx.doi.org/10.3390/ma14020335 Text en © 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Jeong, Gyuwon
Yu, Dong-Yurl
Baek, Seongju
Bang, Junghwan
Lee, Tae-Ik
Jung, Seung-Boo
Kim, JungSoo
Ko, Yong-Ho
Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
title Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
title_full Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
title_fullStr Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
title_full_unstemmed Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
title_short Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
title_sort interfacial reactions and mechanical properties of sn–58bi solder joints with ag nanoparticles prepared using ultra-fast laser bonding
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7826748/
https://www.ncbi.nlm.nih.gov/pubmed/33440741
http://dx.doi.org/10.3390/ma14020335
work_keys_str_mv AT jeonggyuwon interfacialreactionsandmechanicalpropertiesofsn58bisolderjointswithagnanoparticlespreparedusingultrafastlaserbonding
AT yudongyurl interfacialreactionsandmechanicalpropertiesofsn58bisolderjointswithagnanoparticlespreparedusingultrafastlaserbonding
AT baekseongju interfacialreactionsandmechanicalpropertiesofsn58bisolderjointswithagnanoparticlespreparedusingultrafastlaserbonding
AT bangjunghwan interfacialreactionsandmechanicalpropertiesofsn58bisolderjointswithagnanoparticlespreparedusingultrafastlaserbonding
AT leetaeik interfacialreactionsandmechanicalpropertiesofsn58bisolderjointswithagnanoparticlespreparedusingultrafastlaserbonding
AT jungseungboo interfacialreactionsandmechanicalpropertiesofsn58bisolderjointswithagnanoparticlespreparedusingultrafastlaserbonding
AT kimjungsoo interfacialreactionsandmechanicalpropertiesofsn58bisolderjointswithagnanoparticlespreparedusingultrafastlaserbonding
AT koyongho interfacialreactionsandmechanicalpropertiesofsn58bisolderjointswithagnanoparticlespreparedusingultrafastlaserbonding