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Apparent Young’s Modulus of the Adhesive in Numerical Modeling of Adhesive Joints
This article is an evaluation of the phenomena occurring in adhesive joints during curing and their consequences. Considering changes in the values of Young’s modulus distributed along the joint thickness, and potential changes in adhesive strength in the cured state, the use of a numerical model ma...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2021
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7827656/ https://www.ncbi.nlm.nih.gov/pubmed/33440638 http://dx.doi.org/10.3390/ma14020328 |